JPH01109175U - - Google Patents
Info
- Publication number
- JPH01109175U JPH01109175U JP388688U JP388688U JPH01109175U JP H01109175 U JPH01109175 U JP H01109175U JP 388688 U JP388688 U JP 388688U JP 388688 U JP388688 U JP 388688U JP H01109175 U JPH01109175 U JP H01109175U
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- electrical component
- solder land
- shows
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000006071 cream Substances 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Contacts (AREA)
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP388688U JPH01109175U (en]) | 1988-01-18 | 1988-01-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP388688U JPH01109175U (en]) | 1988-01-18 | 1988-01-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01109175U true JPH01109175U (en]) | 1989-07-24 |
Family
ID=31205916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP388688U Pending JPH01109175U (en]) | 1988-01-18 | 1988-01-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01109175U (en]) |
-
1988
- 1988-01-18 JP JP388688U patent/JPH01109175U/ja active Pending